Novel Temporary Bonding and Debonding for Semiconductor Packaging
As IoT, AI and Big Data drive the need for new and enhanced information, data, autonomous driving and communications devices, these devices must adapt to new form factors and diverse functionalities. The diversity of information and communication devices such as smartphones, laptops, data servers for cloud computing, smart mobility, and other smart mobile devices are driving the need for new forms of semiconductor chip architectures and semiconductor die packages.